Collaborative Research: ASCENT: Wafer-Scale Sub-THz Reflectarray for Electrical Needle Bea — NSF Award to University of Texas at D
In this ASCENT project, the team aims to develop a set of semiconductor technologies, including new device fabrication, large-scale heterogeneous integration, and robust beam-alignment system architectures, to achieve electrically controlled collimation of electromagnetic waves in sub-terahertz (sub-THz) frequency band
| Award title | Collaborative Research: ASCENT: Wafer-Scale Sub-THz Reflectarray for Electrical Needle Bea |
|---|---|
| Award ID | 2520251 |
| Awardee | University of Texas at Dallas |
| City | RICHARDSON |
| State | TX |
| Amount obligated | $700,000 |
| Principal investigator | Sourav Dutta |
| Program | ASCENT-Address-Chalg-Eng-Teams, NSF-Intel Semiconductr Partnrs |
| Start date | 10/01/2025 |
| Abstract | In this ASCENT project, the team aims to develop a set of semiconductor technologies, including new device fabrication, large-scale heterogeneous integration, and robust beam-alignment system architectures, to achieve electrically controlled collimation of electromagnetic waves in sub-terahertz (sub-THz) frequency bands at low cost. Compared to the existing 5G wireless bands below 100 GHz, the sub-THz bands offer unprecedented wide bandwidth that can enable ultra-fast data rate for data center n |
| Source | NSF Awards |
$799/mo
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