Collaborative Research: ECLIPSE-CHIPS: Avoiding Contamination by Controlling Charging and — NSF Award to University of Iowa (IA, $
This award is made in response to Dear Colleague Letter 24-130, as part of the ECosystem for Leading Innovation in Plasma Science and Engineering (ECLIPSE) interdisciplinary program. In semiconductor manufacturing, small solid particles, such as dust particles, are a source of contamination. Microchips made from silico
| Award title | Collaborative Research: ECLIPSE-CHIPS: Avoiding Contamination by Controlling Charging and |
|---|---|
| Award ID | 2510501 |
| Awardee | University of Iowa |
| City | IOWA CITY |
| State | IA |
| Amount obligated | $405,000 |
| Principal investigator | John Goree |
| Program | PLASMA PHYSICS, OFFICE OF MULTIDISCIPLINARY AC |
| Start date | 07/01/2025 |
| Abstract | This award is made in response to Dear Colleague Letter 24-130, as part of the ECosystem for Leading Innovation in Plasma Science and Engineering (ECLIPSE) interdisciplinary program. In semiconductor manufacturing, small solid particles, such as dust particles, are a source of contamination. Microchips made from silicon wafers are ruined when a particle lands on its surface during one of the manufacturing steps. Many of these steps involve a plasma to etch or deposit thin films. During these ste |
| Source | NSF Awards |
$799/mo
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