Conference: Low-Dimensional Materials and Electronics Conference — NSF Award to Stanford University (CA, $299,596)
The semiconductor industry is rapidly approaching the fundamental limits of conventional scaling, creating an urgent need for transformative materials and integration strategies that can sustain progress in electronics and advanced artificial intelligence (AI) hardware. Low-dimensional (low-D) materials—metals, semicon
| Award title | Conference: Low-Dimensional Materials and Electronics Conference |
|---|---|
| Award ID | 2549841 |
| Awardee | Stanford University |
| City | STANFORD |
| State | CA |
| Amount obligated | $299,596 |
| Principal investigator | Eric Pop |
| Program | TIP-CHIPS KTA-2 Semi-HPC |
| Start date | 02/15/2026 |
| Abstract | The semiconductor industry is rapidly approaching the fundamental limits of conventional scaling, creating an urgent need for transformative materials and integration strategies that can sustain progress in electronics and advanced artificial intelligence (AI) hardware. Low-dimensional (low-D) materials—metals, semiconductors, and insulators with one-dimensional features such as carbon nanotubes or atomically thin two-dimensional layers like molybdenum disulfide—offer a compelling pathway forwar |
| Source | NSF Awards |
$799/mo
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