ENG-SEMICON: Quantum inspired ab initio simulation of thermal transport near heterojunctio — NSF Award to University of Pittsburgh
A major challenge in designing modern semiconductor devices is removing heat they generate during routine operations. Heat accumulation reduces device performance, shortens its lifespan, and increases the energy required for cooling. This project will examine heat accumulation near “heterojunctions,” which are tiny nan
| Award title | ENG-SEMICON: Quantum inspired ab initio simulation of thermal transport near heterojunctio |
|---|---|
| Award ID | 2518562 |
| Awardee | University of Pittsburgh |
| City | PITTSBURGH |
| State | PA |
| Amount obligated | $449,998 |
| Principal investigator | Sangyeop Lee |
| Program | TTP-Thermal Transport Process |
| Start date | 12/01/2025 |
| Abstract | A major challenge in designing modern semiconductor devices is removing heat they generate during routine operations. Heat accumulation reduces device performance, shortens its lifespan, and increases the energy required for cooling. This project will examine heat accumulation near “heterojunctions,” which are tiny nanometer-scale regions where different materials connect to each other. There is an extra thermal resistance at heterojunctions, which makes removing heat there especially difficult. |
| Source | NSF Awards |
$799/mo
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