Monolithic Three-Dimensional Integrated Circuit Technology Based on High-Performance Junct — NSF Award to University of Illinois a
The information revolution is largely driven by semiconductor industry’s capability of incorporating electronic device components in microprocessor chips with increasingly higher density, as described by Moore’s law, during the past 70 years. However, it has become more and more difficult to sustain this progress by fu
| Award title | Monolithic Three-Dimensional Integrated Circuit Technology Based on High-Performance Junct |
|---|---|
| Award ID | 2450485 |
| Awardee | University of Illinois at Urbana-Champaign |
| City | URBANA |
| State | IL |
| Amount obligated | $455,489 |
| Principal investigator | Qing Cao |
| Program | EPMQD: Electronic, Photonic, M |
| Start date | 06/01/2025 |
| Abstract | The information revolution is largely driven by semiconductor industry’s capability of incorporating electronic device components in microprocessor chips with increasingly higher density, as described by Moore’s law, during the past 70 years. However, it has become more and more difficult to sustain this progress by further reducing the size of each transistor since the lateral dimension scaling is approaching its physical limits. This project aims to address this challenge by developing a set o |
| Source | NSF Awards |
$799/mo
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