PFI-TT: Developing Advanced Thermal Packaging Materials for the Semiconductor Industry Usi — NSF Award to William Marsh Rice Unive
This Partnerships for Innovation - Technology Translation (PFI-TT) project seeks to improve the chip packaging industry. Semiconductors are the foundation for top U.S. exports such as artificial intelligence, medical devices, and transportation vehicles. Optimizing thermal management via innovative packaging materials
| Award title | PFI-TT: Developing Advanced Thermal Packaging Materials for the Semiconductor Industry Usi |
|---|---|
| Award ID | 2431965 |
| Awardee | William Marsh Rice University |
| City | HOUSTON |
| State | TX |
| Amount obligated | $550,000 |
| Principal investigator | Jun Lou |
| Program | Special Projects |
| Start date | 05/15/2025 |
| Abstract | This Partnerships for Innovation - Technology Translation (PFI-TT) project seeks to improve the chip packaging industry. Semiconductors are the foundation for top U.S. exports such as artificial intelligence, medical devices, and transportation vehicles. Optimizing thermal management via innovative packaging materials enhances the electronics' efficiency, reliability, and lifespan. In terms of societal impact, improved thermal management benefits high-computing applications like medical imaging |
| Source | NSF Awards |
$799/mo
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